Strengthening Collaboration Between Siemens and TSMC
Siemens Digital Industries Software has announced a deeper collaboration with Taiwan Semiconductor Manufacturing Company (TSMC) to deliver a certified automated design workflow for TSMC’s InFO advanced packaging technology, part of its cutting-edge 3DFabric platform. This milestone builds upon a long-standing partnership between the two companies, aiming to accelerate 3D IC innovation and meet the growing complexity and speed demands of modern semiconductor design.
Certified Automation Powered by Innovator3D IC
According to AJ Incorvaia, Senior Vice President of Siemens Digital Industries Software’s Electronic Board Systems division, the new certified workflow is driven by Innovator3D IC™ and integrated with Xpedition™ Package Designer, ensuring robust design automation even under intense time-to-market pressures. The solution provides designers with flexible, high-performance workflows that streamline 3D IC and heterogeneous integration development, helping clients achieve breakthrough innovations in advanced packaging.
Advanced Tools for InFO_oS and InFO_PoP Technologies
Siemens’ certified automation flow supports TSMC’s InFO_oS (Integrated Fan-Out on Substrate) and InFO_PoP (Package-on-Package) technologies through an integrated suite of industry-leading design tools. The workflow combines Xpedition™ Package Designer, HyperLynx™ DRC, and Calibre® nmDRC—tools recognized globally for precision and scalability in semiconductor packaging design. Together, these solutions enable comprehensive validation, electrical integrity checks, and layout verification within a seamless design environment.
Driving Innovation Across the TSMC OIP Ecosystem
Dan Kochpatcharin, Head of TSMC’s Ecosystem and Alliance Management, highlighted Siemens as a key long-term partner within the TSMC Open Innovation Platform® (OIP) ecosystem. “By delivering high-quality solutions that support TSMC’s advanced processes and packaging technologies, Siemens continues to strengthen its role in enabling our customers to drive innovation for future AI, high-performance computing (HPC), and mobile applications,” Kochpatcharin stated.
This collaboration enhances interoperability between Siemens’ advanced packaging design tools and TSMC’s manufacturing technologies—empowering joint customers to deliver next-generation semiconductor solutions with higher performance and energy efficiency.
Empowering Digital Transformation Through Siemens Xcelerator
Siemens Digital Industries Software is advancing digital transformation across the semiconductor sector through its Siemens Xcelerator business platform. By combining software, hardware, and services, Siemens offers a full-stack industrial software ecosystem and comprehensive digital twin capabilities. These tools allow enterprises to optimize every stage of design, engineering, and manufacturing—transforming innovative ideas into sustainable, high-value products.
From chip to system, and product to production, Siemens enables companies in every industry to create measurable digital value and drive the next wave of intelligent, sustainable industrial innovation.
Pioneering the Future of 3D IC Design
The certified InFO automation workflow represents a major leap forward for 3D IC development. Through this partnership, Siemens and TSMC are not only advancing design automation but also paving the way for the semiconductor industry’s evolution toward heterogeneous integration, miniaturization, and sustainability. This collaboration underscores Siemens’ commitment to enabling digital innovation and redefining the possibilities of next-generation semiconductor design.